How a Printed Circuit Board Manufacturer Works
Printed circuit board fabrication requires the collaboration of many entities. OEMs and CMs must communicate on components, design considerations and file formats to ensure the accuracy of PCB manufacturing processes.
The next step is inner layer imaging. This involves printing the design on a plotter printer to create a film and also printing the solder mask for the inner layer. A machine then creates a registration hole to help keep the films lined up properly with the layers that follow.
1. Design
Printed circuit boards (PCBs) are critical to the operation of many electronic devices, from household appliances to smartphones and high-tech machines. They connect devices by creating conductive pathways and signal traces from copper sheets laminated onto non-conductive substrates. As such, they must be manufactured to strict quality standards to ensure that they perform their required tasks. This is accomplished via a complex procedure that involves copious crucial steps from design to fabrication and assembly.
The PCB design process begins with the creation of a blueprint that represents the desired functionality of the circuit board. These designs are generally created using computer software and can be viewed as a “ghost-line” image, displaying the net connections between components on the board. Once the design has been completed, it is transferred to a manufacturer for production by using a standard file format. In the case of multilayer PCBs, these files must be compatible with one another, and any changes in format can cause problems during the fabrication process.
After the PCB’s conductive patterns are printed on it, technicians add a solder mask to the board using a photo-reactive film. This mask is green in color and protects the copper from oxidation, which could interfere with the board’s functionality. Lastly, the board undergoes a series of inspection and testing procedures to ensure that it meets all manufacturing specifications before being sent out for assembly.
2. Layout
The layout process of a PCB manufacturing plant is crucial for optimizing production and reducing costs. There are two major types of layouts: process and product layouts. The former organizes resources by the product or service they produce, while the latter arranges them around a sequence of operations. Each has its advantages and disadvantages.
A process layout, also known as job shop or functional layout, categorizes similar processes and machines into groups according to their function. This type of layout allows for quick reorganization without the need to retrain personnel or adjust equipment. printed circuit board manufacturer It is most suitable for a factory that produces multiple products, or services that require different skills.
On the other hand, a product layout or line layout is concerned with arranging the machinery and auxiliary facilities based on the sequence of operations for a specific product. This is more appropriate for industries that manufacture standardised products on a large scale such as oil refineries, automobile assembling, cement manufacturing, and paper and rubber.
Using a product layout results in a continuous and hassle-free production process. It minimizes the movement of materials between machines and also reduces the amount of space needed for storing work-in-process. This reduces material handling costs and increases efficiency. It also increases the effectiveness of supervisors as they can be more specialized in their tasks.
3. Fabrication
A PCB is fabricated by first printing onto it the outline of the desired circuit. Then a machine cuts that outline into several smaller pieces called a Printed Circuit Board Manufacturer Supplier construction board. The construction boards are then etched. This process covers the copper parts of the PCB with a chemical that removes the unprotected copper areas, leaving only those portions required in the finished circuit board.
The areas of the bare copper that remain are then patterned with a pattern of light-colored ink or photo-mask detailing the necessary tracks. Then, a light passes through the photo-mask to harden the chemicals in the light-colored areas of the PCB. Then the non-light-colored areas of the PCB are exposed to an acid that eats away at the copper. The resulting patterns are then rinsed and cleaned, leaving behind only the conductive copper traces that are needed.
After the core or inner layers are completed, the fabrication process continues with a step known as routing out. This is where the CM tells the router which scores to make in the construction board, which allows the etching machine to quickly and easily separate individual printed circuit boards from the construction board.
Then silkscreen application takes place to print any desired data on the circuit boards, such as warning labels, part numbers and company logos for manufacturers. This step is a necessary component of quality assurance, and should be done according to industry standards such as IPC-A-600.
4. Testing
Printed circuit boards, or PCBs are the base of almost every electrical and electronic device. They are fabricated using a wide variety of materials. The most common is a glass fiber based board known as FR4. It offers stability and durability. Other materials are used in high performance applications such as radio frequency circuits where the copper must be of a very low loss.
In order to produce a printed circuit board a technician must follow the original blueprint design for each layer of the circuit. This step is referred to as the “silkscreen application” or “legend printing.” Once this step is complete, the panels must be cured using ultraviolet light. A solder mask is then applied, if necessary. This mask protects the traces from oxidation and prevents solder bridges (unintentional connections that form between two conductors) and is a key factor in ensuring that the final product will function properly.
As the last step of fabrication, the inner layers will be inspected with automated optical inspection. This process ensures that each layer is taking form exactly as the original design dictates and that there are no harmful copper remnants from the previous etching stage. If there are no defects, the outer layer will then be silkscreened with vital information such as warning labels and part numbers.