Optical Module PCB Welding Processes
Optical modules finish optical/electrical conversion at the transmitting end and transmit photons into an optical fiber. They’re used in a variety of applications, including data center interconnection and 5G.
With a quad port expander, such as Diodes Incorporated’s PI7C1401, multiple optical modules can be addressed and controlled from a single I2C/SPI interface. This improves a system’s efficiency and reduces cost by eliminating the need for intermediate devices.
Optical Components
The demand for optical modules has increased rapidly because of the growing information application traffic. These devices are used in data centers, cloud computing, the Internet of Things, artificial intelligence, and 5G backhaul networks. The growth of these applications will also increase the need for these Optical Module PCB devices in downstream industries. The demand for optical module PCBs is expected to grow even faster in the future.
Optical module PCBs are composed of optoelectronic devices TOSA and ROSA, functional circuits, and optoelectronic interface components. The optical transceiver component TOSA is responsible for processing the electrical signal and converting it into an optical signal to transmit through the optical fiber. The optical receiving component ROSA processes the optical signal from the optical fiber and converts it into an electrical signal at a corresponding rate.
A key feature of optical modules is their ability to support multiple code rates in the same package. In addition, they offer various form factors, making them a suitable choice for diverse interface protocols and modulation formats. They are available in a wide range of power, distance, and transmission speed configurations.
To improve the performance of optical modules, manufacturers have developed advanced packaging techniques such as eCPRI and laser blind vias. These processes help to reduce the path lengths between ICs and decoupling capacitors, and they can also mitigate thermal performance, stress, and electromagnetic compatibility (EMC) effects.
Welding Process
A welding process called braze welding is used to make a solid union between components. This type of welding involves using liquid metallic filler to connect the components. Brass metal is primarily used in this process to provide the filler. Compared with other welding methods, braze welding offers higher reliability and lower maintenance requirements. It can be used on a wide variety of materials, including non-metallic ones like plastics. It is also appropriate for combining dissimilar materials, such as aluminum and steel.
In the manufacturing of optical modules PCBs, a number of welding processes are used to ensure high quality. Some of these include a thermal trench process, low roughness brown oxide process and laser welding. Combined, these techniques reduce thermal resistance and improve heat dissipation, thereby ensuring high-speed signal transmission.
The Optical Module PCBs must have a symmetrical design to ensure proper operation and reduce signal losses. To support high information prices, they must be able to operate at speeds of up to 10 Gbps. This requires a robust and reliable connection between the components. To achieve this, it is preferable to use a stamp hole + milling groove connection rather than a V-CUT connection.
Moreover, it is also Optical Module PCB Supplier important to perform testing on the optical modules. Common tests include eye diagram margin, extinction ratio and transmit power. In addition, the test equipment must be able to handle the high temperatures of a data center.
Design
Optical Module PCBs are a key component in high-bandwidth data communication applications. The latest optical modules enable hundreds of Gbps to be transmitted from copper on the PCB to optical fiber off the board. This can help reduce power consumption and improve density. However, it is important to remember that these systems can be vulnerable to high-speed signal loss if the PCB layout is not designed properly.
Fortunately, AT&S works with global, renowned optical module manufacturers to empower their high-speed design and manufacturing processes. Our strong R&D team and simulation capabilities can provide thermal performance analysis, warpage, stress, electromagnetic compatibility (EMC), and high-speed signal loss prediction.
The latest optical modules support a variety of interface types, including LC, SC, ST, MU, and MTRJ. In addition to their high transmission rates, optical modules also feature low power consumption. They use an embedded laser that enables them to operate at lower temperatures than conventional modules. This can improve efficiency and increase the lifetime of the module.
Moreover, the new optical modules are compatible with existing equipment. This makes them a cost-effective solution for connecting high-speed devices in the data center. In addition, they are capable of operating at a wide temperature range and can handle the high reflow soldering temperature used in standard reflow processes. This can significantly reduce the amount of time required to rework the optical module.